Silicon Photonics Wafer Level Packaging Design Engineer (f/m/d)
MICROVISION · Ulm · listed 49 days ago
Engineering (other)
Deine Aufgaben • Design and develop wafer level packaging solutions, 2D/2.5D/3D, for advanced silicon photonics platforms • Create and optimise metallisation layouts (e.g. UBM, RDL, Solder, TSVs) to meet electrical, mechanical and manufacturing requirements. • Define and engineer package mechanical…
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