Senior/Staff Process Engineer (Wafer Dicing & Back-grind)
Lumilens · Singapore · listed 9 days ago
SeniorEngineering (other)
Core Responsibilities • Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. • Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting…
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