Package Design Engineering - Director
renesaselectronics · Shah Alam, Selangor, Malaysia · listed 73 days ago
Director
Job Description: We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center…
Read the full description
Free registration — your contact details plus five quick fields about the role you want, or your CV — unlocks every description on the site, plus the apply link.
- The complete posting, as the employer wrote it
- Apply directly on renesaselectronics's own site
- A match score on every job, from your profile or your CV