Package Development Engineer
onsemi · Zhubei, Hsinchu County, Taiwan · listed 45 days ago
Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon…
Read the full description
Free registration — your contact details plus five quick fields about the role you want, or your CV — unlocks every description on the site, plus the apply link.
- The complete posting, as the employer wrote it
- Apply directly on onsemi's own site
- A match score on every job, from your profile or your CV
