Wirebond & Die Attach Process Engineer (MES Project)
Texas Instruments · Wilayah Persekutuan Kuala Lumpur, Malaysia · listed 3 days ago
Engineering (other)
Change the world. Love your job. Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a…
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