Principal Package Design Engineer
renesaselectronics · Tempe, Arizona, United States · listed 4 days ago
SeniorEngineering (other)
Job Description: Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging.  Package technologies qualification for consumer &…
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